Abstract:
During the technological development and design, it is inevitable that one has to use some available components not very reliable for space applications. Due to the complicity of the component’s functions and the variety of device’s packaging, the component level testing is getting more and more difficult. The suggested qualification system in this paper is based on board-level functional testing of the parts and includes several standard elements of the qualification system, such as the destructive physical analysis (DPA), special design evaluations, and innovative qualification methods. An example of monitoring temperature transients and based on the local heating technique is described.
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