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航天元器件關(guān)鍵工藝的統(tǒng)計(jì)過程控制方法

Statistical process control of key processes for space-level component

  • 摘要: 文章以統(tǒng)計(jì)過程控制（SPC）中的均值—標(biāo)準(zhǔn)差（X—R）控制圖理論方法為基礎(chǔ)，以宇航元器件關(guān)鍵工序中的集成電路鍵合拉力強(qiáng)度為研究對(duì)象，提出宇航元器件關(guān)鍵工序進(jìn)行SPC的必要性，并提出以（X—R）控制圖作為質(zhì)量工具對(duì)宇航元器件關(guān)鍵工藝進(jìn)行質(zhì)量監(jiān)控的方法，計(jì)算出該關(guān)鍵工藝的過程能力指數(shù)。

     

    Abstract: Based on the average value - standard deviation () control chart theory of the statistical process control(SPC), the bond strength of the integrated circuit, as an important parameter in processing space-level components and parts, is investigated. The importance of the SPC in processing space-level components and parts is discussed, with the () control chart as a tool for quality control. The process power index in the above key process is calculated.

     

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