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熱熔型聚酰亞胺薄膜的熱封性能研究

The heat sealability of melt-processable polyimide films

  • 摘要: 針對現(xiàn)有商用聚酰亞胺（PI）薄膜無法采用熱熔工藝進行粘接的問題，采用異構化二酐單體、2，3，3’，4’-二苯醚四酸二酐（a-ODPA）分別與7種芳香族二胺單體通過化學亞胺化工藝制備了PI薄膜（PI-1～PI-7），系統(tǒng)研究了這些PI薄膜的結構與性能的關系。結果表明：a-ODPA的不對稱結構賦予了PI薄膜良好的熱塑性特征，使之可以采用熱熔工藝進行粘接，薄膜間的熱封強度最高可達660 N/m；此外，制備的PI薄膜還具有良好的耐熱性能與力學性能，5%失重的溫度超過500℃，玻璃化轉變溫度超過230℃，薄膜拉伸強度超過89 MPa。

     

    Abstract: A series of melt-processable polyimide(PI)films are developed to solve the problem of the infusibility of the commerciallv available PI films. Seven PI films (PI-1~PI-7)are synthesized form an asymmetrical aromatic dianhydride, 2, 3, 3', 4'-oxydiphmalic diallhydride(a-ODPA)and various aromatic diamines via a chemical imidization procedure. The structure-propety relationships of the PIs are investigated. It is shown that the asymmetrical stnlctllre of a-ODPA giVes the derived PIs a good themoplasticity and the PI films could be adhered via a heat-sealing procedure, The adhesive strength between the PI films could reach a maximum value of 660 N/m. In addition, the prepared PI films show good themlal and mechanical pmperties with 5%weight loss temperatures over 500℃, glass transition tempemtures higher man 230℃ and tensile strengths over 89 MPa.

     

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