航天器單機(jī)內(nèi)PCB焊點(diǎn)低氣壓放電試驗(yàn)研究

Low-pressure discharging test for solder fillets on PCBs used in spacecraft units

摘要: 在軌航天器單機(jī)內(nèi)部存在低氣壓放電風(fēng)險(xiǎn)，因此對(duì)于工作電壓等級(jí)較高的PCB,，需要采用放電防護(hù)工藝和措施,。文章針對(duì)幾種現(xiàn)有的放電防護(hù)工藝，試驗(yàn)測(cè)量了不同工藝條件下的焊點(diǎn)起暈電壓。試驗(yàn)結(jié)果表明,，球形焊點(diǎn)的起暈電壓高于正常焊點(diǎn),；焊點(diǎn)之間是否開槽對(duì)起暈電壓無(wú)明顯影響；涂三防漆的焊點(diǎn)起暈電壓顯著高于未涂漆焊電極,。試驗(yàn)結(jié)果能夠?yàn)楹教炱饔肞CB焊點(diǎn)放電防護(hù)工藝評(píng)估提供指導(dǎo),。

Abstract: The risk of discharging always exists inside the unit of spacecraft. Therefore, for PCBs working in a relatively high voltage, anti-discharge techniques and measures are necessary. To evaluate some present aati-discharge technologies, the corona inception voltage(CIV)of solder fillets under different technological conditions is measured. The results show that in similar conditions, the CIV of round shape solder fillets is higher than that of the ordinary solder fillets; there is no obvious difference for solder fillets with or without gap between them; the CIV of solder fillets with functional paint is considerably higher than those without paint. The above test results may provide some guidance for anti-discharge measures for PCBs used in spacecraft.